Qualcomm Snapdragon 870 vs MediaTek Dimensity 9000 Plus. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 865/870 MediaTek Dimensity 9000
• Family
  Qualcomm Snapdragon Mediatek Dimensity
• Generation
  7 3
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Kryo 585 Prime 1x Cortex-X2
• B-Core
  3x Kryo 585 Gold 3x Cortex-A710
• Base Frequency
  1.8 GHz -
• C-Core
  4x Kryo 585 Silver 4x Cortex-A510
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  3.2 GHz -
• Turbo Frequency (8 Cores)
  2.42 GHz -
• A-Core Frequency
  - 1.80 GHz (3.20 GHz)
• B-Core Frequency
  - 2.85 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.0 12
• Execution units
  2 10
• Generation
  6 Vallhall 3
• GPU Frequency
  250 MHz 900 MHz
• GPU name
  Qualcomm Adreno 650 ARM Mali-G710 MP10
• GPU Turbo
  670 MHz No turbo
• Max. displays
  1 1
• Release date
  Q4/2019 Q2/2021
• Shader
  512 0
• Technology
  7 nm 4 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Conflicting source values: Decode | Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 9000 Plus and Qualcomm Snapdragon 870. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  16 GB -
• Memory channels
  4 4
• Memory type
  LPDDR4X-4266LPDDR5-5500 LPDDR5-7500
• Memory Bandwidth
  - 60 GB/s

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 870 and MediaTek Dimensity 9000 Plus Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  10 W -

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 870 and MediaTek Dimensity 9000 Plus, virtual machine technologies and process technology.

• Architecture
  Kryo 585 Cortex-X2 / -A710 / -A510
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  2.00 MB -
• L3-Cache
  3.00 MB -
• Part Number
  SM8250-AC MT6983
• Release date
  Q2/2021 Q3/2022
• Technology
  7 nm 4 nm
• Virtualization
  None None
• Operating systems
  - Android