Qualcomm Snapdragon 870 vs MediaTek Dimensity 9000 Plus. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Dimensity
• Generation
  7 3
• CPU group
  Qualcomm Snapdragon 865/870 MediaTek Dimensity 9000

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 650 ARM Mali-G710 MP10
• GPU frequency
  0.25 GHz 0.90 GHz
• GPU (Turbo)
  0.67 GHz No turbo
• Execution units
  2 10
• Shader
  512 0
• Max. displays
  1 1
• Generation
  6 Vallhall 3
• Technology
  7 nm 4 nm
• Release date
  Q4/2019 Q2/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 9000 Plus and Qualcomm Snapdragon 870. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266LPDDR5-5500 LPDDR5-7500
• Max. Memory
  16 GB
• ECC
  No No
• Memory channels
  4 4

Compare the TDP requirements of TDP Qualcomm Snapdragon 870 and MediaTek Dimensity 9000 Plus to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 870 and Qualcomm Snapdragon 870, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• Architecture
  Kryo 585 Cortex-X2 / -A710 / -A510
• Technology
  7 nm 4 nm
• Socket
  N/A N/A
• Release date
  Q2/2021 Q3/2022
• Part Number
  SM8250-AC MT6983