HiSilicon Kirin 810 vs Qualcomm Snapdragon 778G Plus. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 778
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  6 4
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 1x Kryo 670 Prime
• B-Core
  6x Cortex-A55 3x Kryo 670 Gold
• Base Frequency
  1.9 GHz -
• C-Core
  - 4x Kryo 670 Silver
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz -
• Turbo Frequency (8 Cores)
  2.2 GHz -
• A-Core Frequency
  - 2.5 GHz
• B-Core Frequency
  - 2.2 GHz
• C-Core Frequency
  - 1.9 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.0
• Execution units
  16 4
• Generation
  Bifrost 2 5
• GPU Frequency
  850 MHz -
• GPU name
  ARM Mali-G52 MP6 Qualcomm Adreno 642L
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 1
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q1/2018 Q2/2021
• Shader
  288 384
• Technology
  12 nm 6 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 778G Plus and HiSilicon Kirin 810. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB 16 GB
• Memory channels
  4 2
• Memory type
  LPDDR4X-2133 LPDDR5-3200

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 810 and Qualcomm Snapdragon 778G Plus Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 810 and Qualcomm Snapdragon 778G Plus, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Kryo 670
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  1 MB 2 MB
• Part Number
  - SM7325-AE
• Release date
  Q2/2019 Q4/2021
• Technology
  7 nm 6 nm
• Virtualization
  None None
• Operating systems
  - Android