HiSilicon Kirin 810
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Overall score
star star star star star
Released
Q2/2019
HiSilicon Kirin 810

Processor HiSilicon Kirin 810, specifications and benchmarks

1732 place in the overall ranking CPUs!
HiSilicon Kirin 810 Processor is being reviewed, the release of which was held in Q2/2019. Here are all the HiSilicon Kirin 810’s specifications and performance estimation in benchmark. We offer to study all the data and compare it with a competing model. The base clock frequency of the model is 1.90 GHz, total of cores is 8. The CPU supports LPDDR4X-2133 and is installed in the motherboard on Socket N/A. The TDP for CPU is 5 W.

Specifications

Technical data
CPU family and group

General information about the processor HiSilicon Kirin 810

  • Segment
    Mobile
  • Family
  • Generation
    6
  • CPU group
    HiSilicon Kirin 810/820
  • Predecessor
    --
  • Successor
    --
CPU Technical specs

HiSilicon Kirin 810 Processor performance parameters, CPU capabilities

  • Frequency
    1.90 GHz
  • CPU Cores
    8
  • Turbo (1 Core)
    2.20 GHz
  • CPU Threads
    8
  • Turbo (8 Cores)
    2.20 GHz
  • Hyperthreading
    No
  • Overclocking
    No
  • Core architecture
    hybrid (big.LITTLE)
  • A core
    2x Cortex-A76
  • B core
    6x Cortex-A55
  • C core
    --
IGPU

Built-in graphics chip characteristics

  • GPU name
    ARM Mali-G52 MP6
  • GPU frequency
    0.85 GHz
  • GPU (Turbo)
    No turbo
  • Execution units
    16
  • Shader
    288
  • Max. GPU Memory
    4 GB
  • Max. displays
    2
  • Generation
    Bifrost 2
  • DirectX Version
    12
  • Technology
    12 nm
  • Release date
    Q1/2018
Hardware codec support

Built-in support for video and image compression standards

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    No
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory specs & PCI

Technical characteristics of supported memory, PCI bus

  • Memory type
    LPDDR4X-2133
  • Max. Memory
    6 GB
  • ECC
    No
  • Memory channels
    4
  • PCIe version
  • PCIe lanes
Encryption

Hardware security technology

  • AES-NI
    No
Thermal Management
  • TDP (PL1)
    5 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Tjunction max.
    --
* see below
Technologies and extensions

Technical capabilities of the processor, information

  • Instruction set (ISA)
    ARMv8-A64 (64 bit)
  • Virtualization
    None
  • ISA extensions
  • L2-Cache
    --
  • L3-Cache
    1.00 MB
  • Architecture
    Cortex-A76 / Cortex-A55
  • Technology
    7 nm
  • Socket
    N/A
  • Release date
    Q2/2019
  • Part Number
    --
Positions in all rankings

Common positions HiSilicon Kirin 810 CPU in popular benchmarks, for comparison with other models.

  • Geekbench 5, 64bit (Single-Core)
    1036 place
  • Geekbench 5, 64bit (Multi-Core)
    970 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1435 place

Benchmarks

Performance tests CPU

Compare the scores of popular benchmarks HiSilicon Kirin 810 with other processors to understand the real speed of the CPU when processing content.

Tests include mathematical calculations, creation of 3D models, cryptocurrency mining, tests in single and multi-core modes.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
1975
1965
1953
1951
HiSilicon Kirin 810
iGPU - FP32 Performance (Single-precision GFLOPS)
The performance of the iGPU - the internal GPU in games
160
160
160
157
HiSilicon Kirin 810

Synonyms

Similar processors in terms of performance.

Similar in technical data processors with HiSilicon Kirin 810.

Intel Core 2 Extreme QX9650 View
Intel Atom E3845 View
Intel Atom Z3775D View
Intel Atom Z3775 View
MediaTek Helio P23 View
AMD E2-1800 View
AMD E2-3000 View
AMD E1-2500 View

*

PL1 - Amount of heat in watts generated by the processor (or GPU) during normal operation.

PL2 - on overclocking

The values are used to select the optimal cooling system and power supply.

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HiSilicon Kirin 810

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