HiSilicon Kirin 985 5G vs HiSilicon Kirin 810. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 980 HiSilicon Kirin 810/820
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  7 6
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Cortex-A76 2x Cortex-A76
• B-Core
  3x Cortex-A76 6x Cortex-A55
• Base Frequency
  1.84 GHz 1.9 GHz
• C-Core
  4x Cortex-A55 -
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.4 GHz 2.2 GHz
• Turbo Frequency (8 Cores)
  2.58 GHz 2.2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  8 16
• Generation
  Vallhall 1 Bifrost 2
• GPU Frequency
  800 MHz 850 MHz
• GPU name
  ARM Mali-G77 MP8 ARM Mali-G52 MP6
• GPU Turbo
  No turbo No turbo
• Max. displays
  1 2
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q2/2019 Q1/2018
• Shader
  128 288
• Technology
  7 nm 12 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  Decode No
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 810 and HiSilicon Kirin 985 5G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 6 GB
• Memory channels
  4 4
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 985 5G and HiSilicon Kirin 810 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 5 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 985 5G and HiSilicon Kirin 810, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  - 1.00 MB
• Part Number
  Hi6290 -
• Release date
  Q2/2020 Q2/2019
• Technology
  7 nm 7 nm
• Virtualization
  None None