HiSilicon Kirin 810 vs HiSilicon Kirin 820 5G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 810/820 HiSilicon Kirin 810/820
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  6 6
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 4x Cortex-A76
• B-Core
  6x Cortex-A55 4x Cortex-A55
• Base Frequency
  1.9 GHz 1.84 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz 2.36 GHz
• Turbo Frequency (8 Cores)
  2.2 GHz 2.36 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  16 6
• Generation
  Bifrost 2 Vallhall 1
• GPU Frequency
  850 MHz 850 MHz
• GPU name
  ARM Mali-G52 MP6 ARM Mali-G57 MP6
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 2
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q1/2018 Q2/2020
• Shader
  288 96
• Technology
  12 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 820 5G and HiSilicon Kirin 810. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB -
• Memory channels
  4 4
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 810 and HiSilicon Kirin 820 5G Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W 6 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 810 and HiSilicon Kirin 820 5G, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  1.00 MB 2.00 MB
• Release date
  Q2/2019 Q2/2019
• Technology
  7 nm 7 nm
• Virtualization
  None None