HiSilicon Kirin 710 vs Qualcomm Snapdragon 665. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 710 Qualcomm Snapdragon 662/665
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  5 7
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 4x Kryo 260 Gold
• B-Core
  4x Cortex-A53 4x Kryo 260 Silver
• Base Frequency
  1.7 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz 2 GHz
• Turbo Frequency (8 Cores)
  2.2 GHz 1.8 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 12.1
• Execution units
  8 0
• Generation
  Bifrost 1 6
• GPU Frequency
  650 MHz -
• GPU name
  ARM Mali-G51 MP4 Qualcomm Adreno 610
• GPU Turbo
  1000 MHz No turbo
• Max. displays
  2 0
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q2/2018 Q2/2019
• Shader
  128 128
• Technology
  12 nm 11 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  No Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 665 and HiSilicon Kirin 710. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB -
• Memory channels
  2 2
• Memory type
  LPDDR3LPDDR4 LPDDR3-1866LPDDR4X-1866

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 710 and Qualcomm Snapdragon 665 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 710 and Qualcomm Snapdragon 665, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Kryo 260
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  1 MB -
• Part Number
  - SM6125
• Release date
  Q3/2018 Q2/2019
• Technology
  12 nm 11 nm
• Virtualization
  None None