HiSilicon Kirin 710 vs HiSilicon Kirin 960. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 710 HiSilicon Kirin 960
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  5 5
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 4x Cortex-A73
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Base Frequency
  1.7 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz 2.4 GHz
• Turbo Frequency (8 Cores)
  2.2 GHz 2.4 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  8 8
• Generation
  Bifrost 1 Bifrost 1
• GPU Frequency
  650 MHz 900 MHz
• GPU name
  ARM Mali-G51 MP4 ARM Mali-G71 MP8
• GPU Turbo
  1000 MHz No turbo
• Max. displays
  2 2
• Max. GPU Memory
  4 GB 2 GB
• Release date
  Q2/2018 Q2/2016
• Shader
  128 256
• Technology
  12 nm 16 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode No
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode No

Types, channel quantity of RAM supported by HiSilicon Kirin 960 and HiSilicon Kirin 710. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB 6 GB
• Memory channels
  2 2
• Memory type
  LPDDR3LPDDR4 LPDDR4-1600

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 710 and HiSilicon Kirin 960 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W 5 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 710 and HiSilicon Kirin 960, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A73 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  1 MB 4 MB
• Release date
  Q3/2018 Q4/2016
• Technology
  12 nm 16 nm
• Virtualization
  None None