HiSilicon Kirin 970 vs HiSilicon Kirin 710. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 970 HiSilicon Kirin 710
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  6 5
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 4x Cortex-A73
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Base Frequency
  1.84 GHz 1.7 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.4 GHz 2.2 GHz
• Turbo Frequency (8 Cores)
  2.4 GHz 2.2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 11
• Execution units
  12 8
• Generation
  Bifrost 2 Bifrost 1
• GPU Frequency
  750 MHz 650 MHz
• GPU name
  ARM Mali-G72 MP12 ARM Mali-G51 MP4
• GPU Turbo
  No turbo 1000 MHz
• Max. displays
  1 2
• Max. GPU Memory
  2 GB 4 GB
• Release date
  Q3/2017 Q2/2018
• Shader
  192 128
• Technology
  16 nm 12 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode No
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 710 and HiSilicon Kirin 970. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB 6 GB
• Memory channels
  4 2
• Memory type
  LPDDR4X-2133 LPDDR3LPDDR4

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 970 and HiSilicon Kirin 710 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  9 W 5 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 970 and HiSilicon Kirin 710, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A73 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2 MB 1 MB
• Release date
  Q3/2017 Q3/2018
• Technology
  10 nm 12 nm
• Virtualization
  None None