HiSilicon Kirin 710
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Overall score
star star star star star
Released
Q3/2018
HiSilicon Kirin 710

Processor HiSilicon Kirin 710, specifications and benchmarks

1625 place in the overall ranking CPUs!
HiSilicon Kirin 710 Processor is being reviewed, the release of which was held in Q3/2018. Here are all the HiSilicon Kirin 710’s specifications and performance estimation in benchmark. We offer to study all the data and compare it with a competing model. The base clock frequency of the model is 1.70 GHz, total of cores is 8. The CPU supports LPDDR3LPDDR4 and is installed in the motherboard on Socket N/A. The TDP for CPU is 5 W.

Specifications

Technical data
CPU family and group

General information about the processor HiSilicon Kirin 710

  • Segment
    Mobile
  • Family
  • Generation
    5
  • CPU group
    HiSilicon Kirin 710
  • Predecessor
    --
  • Successor
    --
CPU Technical specs

HiSilicon Kirin 710 Processor performance parameters, CPU capabilities

  • Frequency
    1.70 GHz
  • CPU Cores
    8
  • Turbo (1 Core)
    2.20 GHz
  • CPU Threads
    8
  • Turbo (8 Cores)
    2.20 GHz
  • Hyperthreading
    No
  • Overclocking
    No
  • Core architecture
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A73
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

Built-in graphics chip characteristics

  • GPU name
    ARM Mali-G51 MP4
  • GPU frequency
    0.65 GHz
  • GPU (Turbo)
    1.00 GHz
  • Execution units
    8
  • Shader
    128
  • Max. GPU Memory
    4 GB
  • Max. displays
    2
  • Generation
    Bifrost 1
  • DirectX Version
    11
  • Technology
    12 nm
  • Release date
    Q2/2018
Hardware codec support

Built-in support for video and image compression standards

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    No
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    No
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory specs & PCI

Technical characteristics of supported memory, PCI bus

  • Memory type
    LPDDR3LPDDR4
  • Max. Memory
    6 GB
  • ECC
    No
  • Memory channels
    2
  • PCIe version
  • PCIe lanes
Encryption

Hardware security technology

  • AES-NI
    No
Thermal Management
  • TDP (PL1)
    5 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Tjunction max.
    --
* see below
Technologies and extensions

Technical capabilities of the processor, information

  • Instruction set (ISA)
    ARMv8-A64 (64 bit)
  • Virtualization
    None
  • ISA extensions
  • L2-Cache
    --
  • L3-Cache
    1.00 MB
  • Architecture
    Cortex-A73 / Cortex-A53
  • Technology
    12 nm
  • Socket
    N/A
  • Release date
    Q3/2018
  • Part Number
    --
Positions in all rankings

Common positions HiSilicon Kirin 710 CPU in popular benchmarks, for comparison with other models.

  • Geekbench 5, 64bit (Single-Core)
    1335 place
  • Geekbench 5, 64bit (Multi-Core)
    1205 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1423 place
  • AnTuTu 8 benchmark
    73 place

Benchmarks

Performance tests CPU

Compare the scores of popular benchmarks HiSilicon Kirin 710 with other processors to understand the real speed of the CPU when processing content.

Tests include mathematical calculations, creation of 3D models, cryptocurrency mining, tests in single and multi-core modes.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
327
324
324
322
HiSilicon Kirin 710
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
1287
1275
1271
1270
HiSilicon Kirin 710
iGPU - FP32 Performance (Single-precision GFLOPS)
The performance of the iGPU - the internal GPU in games
168
168
168
166
HiSilicon Kirin 710

Synonyms

Similar processors in terms of performance.

Similar in technical data processors with HiSilicon Kirin 710.

AMD A4-3300 View
Intel Pentium N3530 View
Qualcomm Snapdragon 429 View
Intel Celeron N3150 View
AMD A8-5545M View
Qualcomm Snapdragon 660 View
Intel Pentium Gold 5405U View
Qualcomm Snapdragon 660 non LTE View

*

PL1 - Amount of heat in watts generated by the processor (or GPU) during normal operation.

PL2 - on overclocking

The values are used to select the optimal cooling system and power supply.

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HiSilicon Kirin 710

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