HiSilicon Kirin 710 vs Qualcomm Snapdragon 665. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  5 7
• CPU group
  HiSilicon Kirin 710 Qualcomm Snapdragon 662/665

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.70 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.20 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.20 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A73 4x Kryo 260 Gold
• B core
  4x Cortex-A53 4x Kryo 260 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G51 MP4 Qualcomm Adreno 610
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  1.00 GHz No turbo
• Execution units
  8 0
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 0
• Generation
  Bifrost 1 6
• DirectX Version
  11 12.1
• Technology
  12 nm 11 nm
• Release date
  Q2/2018 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 665 and HiSilicon Kirin 710. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3LPDDR4 LPDDR3-1866LPDDR4X-1866
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  2 2

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 710 and Qualcomm Snapdragon 665 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 710 and HiSilicon Kirin 710, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  1.00 MB --
• Architecture
  Cortex-A73 / Cortex-A53 Kryo 260
• Technology
  12 nm 11 nm
• Socket
  N/A N/A
• Release date
  Q3/2018 Q2/2019
• Part Number
  -- SM6125