HiSilicon Kirin 710 vs MediaTek Dimensity 6020. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 710 MediaTek Dimensity 6000
• Family
  HiSilicon Kirin Mediatek Dimensity
• Generation
  5 0
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 2x Cortex-A76
• B-Core
  4x Cortex-A53 6x Cortex-A55
• Base Frequency
  1.7 GHz -
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz -
• Turbo Frequency (8 Cores)
  2.2 GHz -
• A-Core Frequency
  - 2.2 GHz
• B-Core Frequency
  - 2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 12
• Execution units
  8 2
• Generation
  Bifrost 1 Vallhall 1
• GPU Frequency
  650 MHz 10 MHz
• GPU name
  ARM Mali-G51 MP4 ARM Mali-G57 MP2
• GPU Turbo
  1000 MHz No turbo
• Max. displays
  2 2
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q2/2018 Q2/2020
• Shader
  128 32
• Technology
  12 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 6020 and HiSilicon Kirin 710. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB -
• Memory channels
  2 2 (Dual Channel)
• Memory type
  LPDDR3LPDDR4 LPDDR4X-2133
• Memory Bandwidth
  - 17.1 GB/s

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 710 and MediaTek Dimensity 6020 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 710 and MediaTek Dimensity 6020, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  1 MB -
• Release date
  Q3/2018 Q1/2023
• Technology
  12 nm 7 nm
• Virtualization
  None None
• Chip design
  - Chiplet
• Documents
  - Technical data sheet
• Operating systems
  - Android