HiSilicon Kirin 620 vs HiSilicon Kirin 9000E. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 620 HiSilicon Kirin 9000
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  3 9
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  - 1x Cortex-A77
• B-Core
  - 3x Cortex-A77
• Base Frequency
  1.2 GHz 2.04 GHz
• C-Core
  - 4x Cortex-A55
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• CPU Cores
  4 8
• CPU Threads
  4 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  1.2 GHz 3.13 GHz
• Turbo Frequency (4 Cores)
  1.2 GHz -
• Turbo Frequency (8 Cores)
  - 2.54 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  0 12
• Execution units
  4 22
• Generation
  Utgard Vallhall 2
• GPU Frequency
  530 MHz 760 MHz
• GPU name
  ARM Mali-450 MP4 ARM Mali-G78 MP22
• GPU Turbo
  530 MHz No turbo
• Max. displays
  1 1
• Release date
  2012 Q4/2020
• Shader
  64 352
• Technology
  28nm 5 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  No Decode / Encode
• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• JPEG
  No Decode / Encode
• VC-1
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 9000E and HiSilicon Kirin 620. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory channels
  1 4
• Memory type
  LPDDR3 LPDDR4X-2133LPDDR5-2750

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 620 and HiSilicon Kirin 9000E Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 620 and HiSilicon Kirin 9000E, virtual machine technologies and process technology.

• Architecture
  Cortex-A53 Cortex-A77 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q1/2015 Q4/2020
• Technology
  28 nm 5 nm
• Virtualization
  None None