Raspberry Pi 3 B+ (Broadcom BCM2837B0) vs AMD Ryzen Embedded R1600. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Broadcom BCM2837B0 AMD Ryzen Embedded R1000
• Family
  Broadcom BCM AMD Ryzen Embedded
• Generation
  3 1
• Segment
  Desktop / Server Desktop / Server

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A53 -
• Base Frequency
  1.4 GHz 2.6 GHz
• Core architecture
  normal normal
• CPU Cores
  4 2
• CPU Threads
  4 4
• Hyperthreading / SMT
  No Yes
• Overclocking
  Yes No
• Turbo Frequency (1 Core)
  No turbo 3.1 GHz
• Turbo Frequency (4 Cores)
  No turbo -
• Core Configuration
  - 2x

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• Execution units
  2 -
• Generation
  5 -
• GPU Frequency
  400 MHz -
• GPU name
  Broadcom VideoCore 5 no iGPU
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 -
• Max. GPU Memory
  1 GB -
• Release date
  02/2016 -
• Shader
  24 -
• Technology
  40 nm -

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode | Decode / Encode No
• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• JPEG
  Decode / Encode No
• VC-1
  Decode No
• VP8
  Decode No
• VP9
  No No

Types, channel quantity of RAM supported by AMD Ryzen Embedded R1600 and Raspberry Pi 3 B+ (Broadcom BCM2837B0). Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No Yes
• Max. Memory
  1024 GB 32 GB
• Memory channels
  1 2
• Memory type
  LPDDR2 DDR4-2400
• Memory Bandwidth
  - 38.4 GB/s
• PCIe
  - 3.0 x 8

• AES-NI
  No Yes

Compare the TDP requirements of TDP Raspberry Pi 3 B+ (Broadcom BCM2837B0) and AMD Ryzen Embedded R1600 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  - 105 °C
• TDP (PL1, legacy label)
  7 W 15 W
• TDP down
  4 W 12 W
• TDP up
  - 25 W

Architecture, interfaces, additional instructions supported by Raspberry Pi 3 B+ (Broadcom BCM2837B0) and AMD Ryzen Embedded R1600, virtual machine technologies and process technology.

• Architecture
  Cortex-A15 Banded Kestrel (Zen)
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  - SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  0.5 MB 1 MB
• L3-Cache
  - 4 MB
• Release date
  02/2016 Q2/2019
• Socket
  - FP5
• Technology
  40 nm 14 nm
• Virtualization
  None AMD-V, SVM
• Documents
  - Technical data sheet