AMD Ryzen Embedded R2312 vs AMD Ryzen Embedded R1600. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  AMD Ryzen Embedded AMD Ryzen Embedded
• CPU group
  AMD Ryzen Embedded R2000 AMD Ryzen Embedded R1000
• Segment
  Desktop / Server Desktop / Server
• Generation
  2 1

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  2 / 4 2 / 4
• Core architecture
  normal normal
• Cores
  4x 2x
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No
• Frequency
  2.70 GHz 2.60 GHz
• Turbo Frequency (1 Core)
  3.50 GHz 3.10 GHz
• Turbo Frequency (2 Cores)
  3.10 GHz --

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  AMD Radeon Vega 3 Graphics no iGPU
• GPU frequency
  1.20 GHz --
• GPU (Turbo)
  No turbo No turbo
• Execution units
  3 --
• Shader
  192 --
• Max. GPU Memory
  2 GB --
• Max. displays
  3 --
• Generation
  8 --
• Direct X
  12 --
• Technology
  14 nm --
• Release date
  Q1/2018 --

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Types, channel quantity of RAM supported by AMD Ryzen Embedded R1600 and AMD Ryzen Embedded R2312. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-2400 DDR4-2400
• Max. Memory
  32 GB 32 GB
• Memory channels
  2 2
• Bandwidth
  38.4 GB/s 38.4 GB/s
• ECC
  Yes Yes
• PCIe
  3.0 x 8 3.0 x 8
• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD Ryzen Embedded R2312 and AMD Ryzen Embedded R1600 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 15 W
• TDP up
  25 W 25 W
• TDP down
  12 W 12 W
• Tjunction max.
  105 °C 105 °C

Architecture, interfaces, additional instructions supported by AMD Ryzen Embedded R2312 and AMD Ryzen Embedded R2312, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  1.00 MB 1.00 MB
• L3-Cache
  2.00 MB 4.00 MB
• Architecture
  Zen+ Banded Kestrel (Zen)
• Documents
  -- Technical data sheet
• Technology
  12 nm 14 nm
• Virtualization
  AMD-V, SVM AMD-V, SVM
• Socket
  FP5 FP5
• Release date
  Q2/2022 Q2/2019