AMD Ryzen Embedded R2312 vs AMD Ryzen Embedded R1600. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  AMD Ryzen Embedded R2000 AMD Ryzen Embedded R1000
• Family
  AMD Ryzen Embedded AMD Ryzen Embedded
• Generation
  2 1
• Segment
  Desktop / Server Desktop / Server

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• Base Frequency
  2.7 GHz 2.6 GHz
• Core architecture
  normal normal
• Core Configuration
  4x 2x
• CPU Cores
  2 2
• CPU Threads
  4 4
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No
• Turbo Frequency (1 Core)
  3.5 GHz 3.1 GHz
• Turbo Frequency (2 Cores)
  3.1 GHz -

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 -
• Execution units
  3 -
• Generation
  8 -
• GPU Frequency
  1200 MHz -
• GPU name
  AMD Radeon Vega 3 Graphics no iGPU
• GPU Turbo
  No turbo No turbo
• Max. displays
  3 -
• Max. GPU Memory
  2 GB -
• Release date
  Q1/2018 -
• Shader
  192 -
• Technology
  14 nm -

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode No
• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• JPEG
  Decode / Encode No
• VC-1
  Decode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No

Types, channel quantity of RAM supported by AMD Ryzen Embedded R1600 and AMD Ryzen Embedded R2312. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  Yes Yes
• Max. Memory
  32 GB 32 GB
• Memory Bandwidth
  38.4 GB/s 38.4 GB/s
• Memory channels
  2 2
• Memory type
  DDR4-2400 DDR4-2400
• PCIe
  3.0 x 8 3.0 x 8

• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD Ryzen Embedded R2312 and AMD Ryzen Embedded R1600 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  105 °C 105 °C
• TDP (PL1, legacy label)
  15 W 15 W
• TDP down
  12 W 12 W
• TDP up
  25 W 25 W

Architecture, interfaces, additional instructions supported by AMD Ryzen Embedded R2312 and AMD Ryzen Embedded R1600, virtual machine technologies and process technology.

• Architecture
  Zen+ Banded Kestrel (Zen)
• Documents
  - Technical data sheet
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  1 MB 1 MB
• L3-Cache
  2 MB 4 MB
• Release date
  Q2/2022 Q2/2019
• Socket
  FP5 FP5
• Technology
  12 nm 14 nm
• Virtualization
  AMD-V, SVM AMD-V, SVM