HiSilicon Kirin 960 vs Qualcomm Snapdragon 810 v2. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  5 2
• CPU group
  HiSilicon Kirin 960 Qualcomm Snapdragon 808/810

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.50 GHz
• Turbo (1 Core)
  2.40 GHz 2.00 GHz
• Turbo (8 Cores)
  2.40 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G71 MP8 Qualcomm Adreno 430
• GPU frequency
  0.90 GHz 0.63 GHz
• GPU (Turbo)
  No turbo 0.63 GHz
• Execution units
  8 0
• Shader
  256 256
• Max. GPU Memory
  2 GB --
• Max. displays
  2 0
• Generation
  Bifrost 1 4
• Technology
  16 nm 20 nm
• Release date
  Q2/2016 Q2/2014

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 810 v2 and HiSilicon Kirin 960. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4-1600 LPDDR4-1600
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  2 2

Compare the TDP requirements of TDP HiSilicon Kirin 960 and Qualcomm Snapdragon 810 v2 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 960 and HiSilicon Kirin 960, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  4.00 MB --
• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A57 / Cortex-A53
• Technology
  16 nm 20 nm
• Socket
  N/A N/A
• Release date
  Q4/2016 2015
• Part Number
  -- MSM8994v2