HiSilicon Kirin 960 vs Qualcomm Snapdragon 810 v2. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 960 Qualcomm Snapdragon 808/810
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  5 2
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 4x Cortex-A57
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Base Frequency
  1.8 GHz 1.5 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.4 GHz 2 GHz
• Turbo Frequency (8 Cores)
  2.4 GHz 2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  8 0
• Generation
  Bifrost 1 4
• GPU Frequency
  900 MHz 630 MHz
• GPU name
  ARM Mali-G71 MP8 Qualcomm Adreno 430
• GPU Turbo
  No turbo 630 MHz
• Max. displays
  2 0
• Max. GPU Memory
  2 GB -
• Release date
  Q2/2016 Q2/2014
• Shader
  256 256
• Technology
  16 nm 20 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No Decode
• VP8
  Decode / Encode No
• VP9
  No No

Types, channel quantity of RAM supported by Qualcomm Snapdragon 810 v2 and HiSilicon Kirin 960. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB -
• Memory channels
  2 2
• Memory type
  LPDDR4-1600 LPDDR4-1600

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 960 and Qualcomm Snapdragon 810 v2 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 960 and Qualcomm Snapdragon 810 v2, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A57 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  4 MB -
• Part Number
  - MSM8994v2
• Release date
  Q4/2016 2015
• Technology
  16 nm 20 nm
• Virtualization
  None None