Qualcomm Snapdragon 8cx Gen. 2 vs HiSilicon Kirin 810. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon HiSilicon Kirin
• CPU group
  Qualcomm Snapdragon 8cx HiSilicon Kirin 810/820
• Segment
  Mobile Mobile
• Generation
  3 6

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequency
  1.80 GHz 1.90 GHz
• Turbo (1 Core)
  2.84 GHz 2.20 GHz
• Turbo (8 Cores)
  2.84 GHz 2.20 GHz
• Hyperthreading
  No No
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 690 ARM Mali-G52 MP6
• GPU frequency
  0.25 GHz 0.85 GHz
• GPU (Turbo)
  0.59 GHz No turbo
• Execution units
  0 16
• Shader
  0 288
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generation
  6 Bifrost 2
• Technology
  7 nm 12 nm
• Release date
  Q4/2020 Q1/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 810 and Qualcomm Snapdragon 8cx Gen. 2. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  6 GB
• Memory channels
  8 4
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 8cx Gen. 2 and HiSilicon Kirin 810 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 5 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 8cx Gen. 2 and Qualcomm Snapdragon 8cx Gen. 2, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB 1.00 MB
• Architecture
  Kryo 495 Cortex-A76 / Cortex-A55
• Technology
  7 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q4/2018 Q2/2019