Qualcomm Snapdragon 845 vs Intel Core i3-10100. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Desktop / Server
• Family
  Qualcomm Snapdragon Intel Core i3
• Generation
  5 10
• CPU group
  Qualcomm Snapdragon 845 Intel Core i 10000
• Predecessor
  -- Intel Core i3-9100

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 3.60 GHz
• CPU Cores
  8 4
• Turbo (1 Core)
  2.80 GHz 4.30 GHz
• CPU Threads
  8 8
• Hyperthreading
  No Yes
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) normal
• A core
  4x Kryo 385 Gold --
• B core
  4x Kryo 385 Silver --

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 630 Intel UHD Graphics 630
• GPU frequency
  0.70 GHz 0.35 GHz
• GPU (Turbo)
  No turbo 1.10 GHz
• Execution units
  0 24
• Shader
  256 192
• Max. GPU Memory
  8 GB 64 GB
• Max. displays
  2 3
• Generation
  4 9.5
• DirectX Version
  11 12
• Technology
  10 nm 14 nm
• Release date
  Q1/2018 Q4/2017

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i3-10100 and Qualcomm Snapdragon 845. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1866 DDR4-2666
• Max. Memory
  8 GB 128 GB
• ECC
  No No
• Memory channels
  4 2
• PCIe version
  3.0
• PCIe lanes
  16

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 845 and Intel Core i3-10100 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 845 and Qualcomm Snapdragon 845, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT, VT-d
• ISA extensions
  SSE4.1, SSE4.2, AVX2
• L2-Cache
  0.51 MB --
• L3-Cache
  2.00 MB 6.00 MB
• Architecture
  Kryo 385 Comet Lake S
• Technology
  10 nm 14 nm
• Socket
  N/A LGA 1200
• Release date
  Q1/2018 Q2/2020
• Part Number
  SDM845 --