Qualcomm Snapdragon 810 vs HiSilicon Kirin 960. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon HiSilicon Kirin
• CPU group
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• Segment
  Mobile Mobile
• Generation
  2 5

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequency
  1.50 GHz 1.80 GHz
• Turbo (1 Core)
  2.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Execution units
  0 8
• Shader
  256 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 2
• Generation
  4 Bifrost 1
• Technology
  20 nm 16 nm
• Release date
  Q2/2014 Q2/2016

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  Decode No
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 960 and Qualcomm Snapdragon 810. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4-1600 LPDDR4-1600
• Max. Memory
  6 GB
• Memory channels
  2 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 810 and HiSilicon Kirin 960 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 810 and Qualcomm Snapdragon 810, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Technology
  20 nm 16 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q3/2014 Q4/2016
• Part Number
  MSM8994 --