Qualcomm Snapdragon 810 vs HiSilicon Kirin 960. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  2 5
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A57 4x Cortex-A73
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Base Frequency
  1.5 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 2.4 GHz
• Turbo Frequency (8 Cores)
  2 GHz 2.4 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  0 8
• Generation
  4 Bifrost 1
• GPU Frequency
  600 MHz 900 MHz
• GPU name
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU Turbo
  600 MHz No turbo
• Max. displays
  0 2
• Max. GPU Memory
  - 2 GB
• Release date
  Q2/2014 Q2/2016
• Shader
  256 256
• Technology
  20 nm 16 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Decode / Encode
• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode No
• VP8
  No Decode / Encode
• VP9
  No No

Types, channel quantity of RAM supported by HiSilicon Kirin 960 and Qualcomm Snapdragon 810. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 6 GB
• Memory channels
  2 2
• Memory type
  LPDDR4-1600 LPDDR4-1600

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 810 and HiSilicon Kirin 960 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 5 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 810 and HiSilicon Kirin 960, virtual machine technologies and process technology.

• Architecture
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  - 4 MB
• Part Number
  MSM8994 -
• Release date
  Q3/2014 Q4/2016
• Technology
  20 nm 16 nm
• Virtualization
  None None