MediaTek Helio G88 vs HiSilicon Kirin 810. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Helio G70/G80 HiSilicon Kirin 810/820
• Family
  Mediatek Helio HiSilicon Kirin
• Generation
  1 6
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A75 2x Cortex-A76
• B-Core
  6x Cortex-A55 6x Cortex-A55
• Base Frequency
  1.8 GHz 1.9 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 2.2 GHz
• Turbo Frequency (8 Cores)
  1.8 GHz 2.2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  2 16
• Generation
  Bifrost 2 Bifrost 2
• GPU Frequency
  1000 MHz 850 MHz
• GPU name
  ARM Mali-G52 MP2 ARM Mali-G52 MP6
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 2
• Max. GPU Memory
  - 4 GB
• Release date
  Q3/2020 Q1/2018
• Shader
  32 288
• Technology
  16 nm 12 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 810 and MediaTek Helio G88. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB 6 GB
• Memory channels
  2 4
• Memory type
  LPDDR4X-1800 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Helio G88 and HiSilicon Kirin 810 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 5 W

Architecture, interfaces, additional instructions supported by MediaTek Helio G88 and HiSilicon Kirin 810, virtual machine technologies and process technology.

• Architecture
  Cortex-A75 / Cortex-A55 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  - 1 MB
• Part Number
  MT6769Z -
• Release date
  Q2/2020 Q2/2019
• Technology
  12 nm 7 nm
• Virtualization
  None None