AMD Ryzen Embedded V1807B vs AMD Sempron 2650. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Desktop / Server Desktop / Server
• Family
  AMD Ryzen Embedded AMD Sempron
• Generation
  1 1
• CPU group
  AMD Ryzen Embedded V1000 AMD Sempron 2000/3000

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  3.35 GHz 1.45 GHz
• CPU Cores
  4 2
• Turbo (1 Core)
  3.80 GHz No turbo
• CPU Threads
  8 2
• Hyperthreading
  Yes No
• Overclocking
  No Yes
• Core architecture
  normal normal

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  AMD Radeon Vega 11 Graphics AMD Radeon HD 8240
• GPU frequency
  1.30 GHz 0.40 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  11 2
• Shader
  704 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 2
• Generation
  8 5
• DirectX Version
  12 11.1
• Technology
  14 nm 28 nm
• Release date
  Q1/2018 Q2/2013

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by AMD Sempron 2650 and AMD Ryzen Embedded V1807B. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-3200 DDR3L-1333 SO-DIMM
• Max. Memory
  32 GB
• ECC
  Yes No
• Memory channels
  2 1
• PCIe version
  3.0
• PCIe lanes
  16

• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD Ryzen Embedded V1807B and AMD Sempron 2650 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 25 W
• TDP up
  54 W --
• TDP down
  35 W --
• Tjunction max.
  105 °C --

Architecture, interfaces, additional instructions supported by AMD Ryzen Embedded V1807B and AMD Ryzen Embedded V1807B, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  AMD-V, SVM AMD-V
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  4.00 MB 1.00 MB
• Architecture
  Great Horned Owl (Zen) Kabini (Jaguar)
• Technology
  14 nm 28 nm
• Socket
  FP5 AM1
• Release date
  Q1/2018 Q2/2014