Qualcomm Snapdragon 8cx Gen. 2
HiSilicon Kirin 810
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Qualcomm Snapdragon 8cx Gen. 2 vs HiSilicon Kirin 810. Specifications, performance, tests

Overall score
star star star star star
Released
Q4/2018
Qualcomm Snapdragon 8cx Gen. 2
Qualcomm Snapdragon 8cx Gen. 2
Released
Q2/2019
Overall score
star star star star star
HiSilicon Kirin 810
HiSilicon Kirin 810

What's the best choice Qualcomm Snapdragon 8cx Gen. 2 or HiSilicon Kirin 810?

We have prepared a comparison to help you choose the best processor. Compare their specifications and benchmarks.

Qualcomm Snapdragon 8cx Gen. 2 has a maximum frequency of 1.80 GHz. 8 / 8 Cores. Power consumption of 7 W. Released in Q4/2018.

HiSilicon Kirin 810 has a maximum frequency of 1.90 GHz. 8 Cores. Power consumption of 5 W. Released in Q2/2019.

Differences

  • Higher turbo clock speed

    Around 23% better overclocked clock speed

    2.84 GHz left arrow 2.20 GHz

Positions in all rankings

Common positions Qualcomm Snapdragon 8cx Gen. 2 CPU in popular benchmarks, for comparison with other models.

  • Geekbench 5, 64bit (Single-Core)
    654 place
  • Geekbench 5, 64bit (Multi-Core)
    563 place
  • Place in the overall ranking

    (based on several benchmarks)

    1454 left arrow score
  • Higher clock speed

    Around 5% better clock speed

    1.90 GHz left arrow 1.80 GHz
  • Performance per watt

    About 0.71 times less performance per watt

    5 W left arrow 7 W

Positions in all rankings

Common positions HiSilicon Kirin 810 CPU in popular benchmarks, for comparison with other models.

  • Geekbench 5, 64bit (Single-Core)
    834 place
  • Geekbench 5, 64bit (Multi-Core)
    716 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1280 place

Specifications

Technical data
Qualcomm Snapdragon 8cx Gen. 2 Qualcomm Snapdragon 8cx Gen. 2
HiSilicon Kirin 810 HiSilicon Kirin 810
CPU family and group

Background information about the processors being compared, series, generation and market segment.

  • Family
    Qualcomm Snapdragon left arrow HiSilicon Kirin
  • CPU group
    Qualcomm Snapdragon 8cx left arrow HiSilicon Kirin 810/820
  • Segment
    Mobile left arrow Mobile
  • Generation
    3 left arrow 6
CPU Technical specs

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

  • Core architecture
    hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
  • Frequency
    1.80 GHz left arrow 1.90 GHz
  • Turbo (1 Core)
    2.84 GHz left arrow 2.20 GHz
  • Turbo (8 Cores)
    2.84 GHz left arrow 2.20 GHz
  • Hyperthreading
    No left arrow No
  • Overclocking
    No left arrow No
IGPU

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

  • GPU name
    Qualcomm Adreno 690 left arrow ARM Mali-G52 MP6
  • GPU frequency
    0.25 GHz left arrow 0.85 GHz
  • GPU (Turbo)
    0.59 GHz left arrow No turbo
  • Execution units
    0 left arrow 16
  • Shader
    0 left arrow 288
  • Max. GPU Memory
    -- left arrow 4 GB
  • Max. displays
    0 left arrow 2
  • Generation
    6 left arrow Bifrost 2
  • Technology
    7 nm left arrow 12 nm
  • Release date
    Q4/2020 left arrow Q1/2018
Hardware codec support

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode left arrow Decode / Encode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP8
    Decode / Encode left arrow Decode / Encode
  • VP9
    Decode left arrow Decode / Encode
  • AV1
    No left arrow No
  • AVC
    Decode left arrow Decode / Encode
  • VC-1
    Decode left arrow Decode / Encode
  • JPEG
    Decode / Encode left arrow Decode / Encode
Memory specs & PCI

Types, channel quantity of RAM supported by HiSilicon Kirin 810 and Qualcomm Snapdragon 8cx Gen. 2. Depending on the motherboards, higher or lower memory frequencies may be supported.

  • Memory type
    LPDDR4X-2133 left arrow LPDDR4X-2133
  • Max. Memory
    left arrow 6 GB
  • Memory channels
    8 left arrow 4
  • ECC
    No left arrow No
Thermal Management

Compare the TDP requirements of TDP Qualcomm Snapdragon 8cx Gen. 2 and HiSilicon Kirin 810 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

  • TDP (PL1)
    7 W left arrow 5 W
Technologies and extensions

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 8cx Gen. 2 and Qualcomm Snapdragon 8cx Gen. 2, virtual machine technologies and process technology.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • L3-Cache
    2.00 MB left arrow 1.00 MB
  • Architecture
    Kryo 495 left arrow Cortex-A76 / Cortex-A55
  • Technology
    7 nm left arrow 7 nm
  • Virtualization
    None left arrow None
  • Socket
    N/A left arrow N/A
  • Release date
    Q4/2018 left arrow Q2/2019

Benchmarks

Performance tests CPUs

Based on the results of several benchmarks, you can more accurately estimate the difference in performance between Qualcomm Snapdragon 8cx Gen. 2 and HiSilicon Kirin 810.

Compare the synthetic test values and choose the best processor!

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively

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