Qualcomm Snapdragon 480 5G vs HiSilicon Kirin 970. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 480 HiSilicon Kirin 970
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  6 6
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Kryo 460 Gold 4x Cortex-A73
• B-Core
  6x Kryo 460 Silver 4x Cortex-A53
• Base Frequency
  1.8 GHz 1.84 GHz
• Core architecture
  normal hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  1.8 GHz 2.4 GHz
• Turbo Frequency (8 Cores)
  1.8 GHz 2.4 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.1 12
• Execution units
  0 12
• Generation
  6 Bifrost 2
• GPU Frequency
  950 MHz 750 MHz
• GPU name
  Qualcomm Adreno 619 ARM Mali-G72 MP12
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 1
• Max. GPU Memory
  4 GB 2 GB
• Release date
  Q2/2020 Q3/2017
• Shader
  128 192
• Technology
  8 nm 16 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode | Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 970 and Qualcomm Snapdragon 480 5G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 8 GB
• Memory channels
  1 4
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 480 5G and HiSilicon Kirin 970 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 9 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 480 5G and HiSilicon Kirin 970, virtual machine technologies and process technology.

• Architecture
  Kryo 460 Cortex-A73 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  - 2.00 MB
• Part Number
  SM4350 -
• Release date
  Q1/2021 Q3/2017
• Technology
  8 nm 10 nm
• Virtualization
  None None