HiSilicon Kirin 910 vs HiSilicon Kirin 710. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  1 5
• CPU group
  HiSilicon Kirin 910 HiSilicon Kirin 710

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.60 GHz 1.70 GHz
• CPU Cores
  4 8
• Turbo (1 Core)
  1.60 GHz 2.20 GHz
• CPU Threads
  4 8
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A73
• B core
  -- 4x Cortex-A53

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-450 MP4 ARM Mali-G51 MP4
• GPU frequency
  0.53 GHz 0.65 GHz
• GPU (Turbo)
  0.53 GHz 1.00 GHz
• Execution units
  4 8
• Shader
  64 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  Utgard Bifrost 1
• DirectX Version
  0 11
• Technology
  28nm 12 nm
• Release date
  2012 Q2/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No No
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 710 and HiSilicon Kirin 910. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3 LPDDR3LPDDR4
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  1 2

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 910 and HiSilicon Kirin 710 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 910 and HiSilicon Kirin 910, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  -- 1.00 MB
• Architecture
  Cortex-A9 Cortex-A73 / Cortex-A53
• Technology
  28 nm 12 nm
• Socket
  N/A N/A
• Release date
  Q1/2014 Q3/2018