HiSilicon Kirin 810 vs Qualcomm Snapdragon 750G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 750
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  6 3
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 2x Kryo 570 Gold
• B-Core
  6x Cortex-A55 6x Kryo 570 Silver
• Base Frequency
  1.9 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz 2.2 GHz
• Turbo Frequency (8 Cores)
  2.2 GHz 2.2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.1
• Execution units
  16 0
• Generation
  Bifrost 2 6
• GPU Frequency
  850 MHz 950 MHz
• GPU name
  ARM Mali-G52 MP6 Qualcomm Adreno 619
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 2
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q1/2018 Q2/2020
• Shader
  288 128
• Technology
  12 nm 8 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 750G and HiSilicon Kirin 810. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB 8 GB
• Memory channels
  4 2
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 810 and Qualcomm Snapdragon 750G Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 810 and Qualcomm Snapdragon 750G, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Kryo 570
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  1 MB -
• Part Number
  - SM7225
• Release date
  Q2/2019 Q4/2020
• Technology
  7 nm 8 nm
• Virtualization
  None None