HiSilicon Kirin 650 vs Intel Core i7-12700. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Desktop / Server
• Family
  HiSilicon Kirin Intel Core i7
• Generation
  4 12
• CPU group
  HiSilicon Kirin 650 Intel Core i 12000
• Predecessor
  -- Intel Core i7-11700

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.70 GHz 2.10 GHz
• CPU Cores
  8 12
• Turbo (1 Core)
  2.00 GHz 4.80 GHz
• CPU Threads
  8 20
• Hyperthreading
  No Yes
• Overclocking
  No Yes
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 8x Golden Cove
• B core
  4x Cortex-A53 4x Gracemont

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-T830 MP2 Intel Iris Xe Graphics 32 (Alder Lake S)
• GPU frequency
  0.90 GHz 0.40 GHz
• GPU (Turbo)
  0.90 GHz 1.45 GHz
• Execution units
  2 32
• Shader
  32 256
• Max. GPU Memory
  -- 16 GB
• Max. displays
  2 4
• Generation
  Midgard 4 12
• DirectX Version
  11 12
• Technology
  28nm 10 nm
• Release date
  Q4/2015 Q4/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  Decode / Encode Decode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-12700 and HiSilicon Kirin 650. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-933 DDR4-3200DDR5-4800
• Max. Memory
  256 GB
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  5.0
• PCIe lanes
  20

• AES-NI
  No Yes

Compare the TDP requirements of TDP HiSilicon Kirin 650 and Intel Core i7-12700 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 650 and HiSilicon Kirin 650, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT, VT-d
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX2+
• L2-Cache
  -- 2.50 MB
• L3-Cache
  -- 25.00 MB
• Architecture
  Cortex-A53 / Cortex-A53 Alder Lake S
• Technology
  16 nm 10 nm
• Socket
  N/A LGA 1700
• Release date
  Q2/2016 Q4/2021