AMD Epyc 72F3 vs HiSilicon Kirin 9000. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Desktop / Server Mobile
• Family
  AMD Epyc HiSilicon Kirin
• Generation
  3 9
• CPU group
  AMD Epyc 7003 HiSilicon Kirin 9000

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  3.70 GHz 2.05 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  4.10 GHz 3.13 GHz
• CPU Threads
  16 8
• Turbo (8 Cores)
  3.90 GHz 2.54 GHz
• Hyperthreading
  Yes No
• Overclocking
  No No
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  no iGPU ARM Mali-G78 MP24
• GPU frequency
  0.76 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  24
• Shader
  384
• Max. displays
  1
• Generation
  Vallhall 2
• DirectX Version
  12
• Technology
  5 nm
• Release date
  Q4/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 9000 and AMD Epyc 72F3. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-3200 LPDDR4X-2133LPDDR5-2750
• ECC
  Yes No
• Memory channels
  8 4
• PCIe version
  4.0
• PCIe lanes
  128

• AES-NI
  Yes No

Compare the TDP requirements of TDP AMD Epyc 72F3 and HiSilicon Kirin 9000 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  180 W
• TDP up
  200 W --
• TDP down
  165 W --

Architecture, interfaces, additional instructions supported by AMD Epyc 72F3 and AMD Epyc 72F3, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  AMD-V, SVM None
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L3-Cache
  256.00 MB --
• Architecture
  Milan (Zen 3) Cortex-A77 / Cortex-A55
• Technology
  7 nm 5 nm
• Socket
  SP3 N/A
• Release date
  Q1/2021 Q4/2020