Qualcomm Snapdragon 860 vs HiSilicon Kirin 820 5G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 855/860 HiSilicon Kirin 810/820
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  6 6
• Predecessor
  Qualcomm Snapdragon 855+ -
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Kryo 485 Prime 4x Cortex-A76
• B-Core
  3x Kryo 485 Gold 4x Cortex-A55
• Base Frequency
  1.8 GHz 1.84 GHz
• C-Core
  4x Kryo 485 Silver -
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.96 GHz 2.36 GHz
• Turbo Frequency (8 Cores)
  2.42 GHz 2.36 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.0 12
• Execution units
  4 6
• Generation
  5 Vallhall 1
• GPU Frequency
  250 MHz 850 MHz
• GPU name
  Qualcomm Adreno 640 ARM Mali-G57 MP6
• GPU Turbo
  680 MHz No turbo
• Max. displays
  1 2
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q1/2019 Q2/2020
• Shader
  384 96
• Technology
  7 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  No Decode / Encode
• VC-1
  No Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 820 5G and Qualcomm Snapdragon 860. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  16 GB -
• Memory channels
  4 4
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 860 and HiSilicon Kirin 820 5G Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 6 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 860 and HiSilicon Kirin 820 5G, virtual machine technologies and process technology.

• Architecture
  Kryo 485 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB -
• L3-Cache
  3.00 MB 2.00 MB
• Part Number
  SM8150-AC -
• Release date
  Q1/2021 Q2/2019
• Technology
  7 nm 7 nm
• Virtualization
  None None