Qualcomm Snapdragon 670 vs MediaTek Dimensity 1000L. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 670 MediaTek Dimensity 1000
• Family
  Qualcomm Snapdragon Mediatek Dimensity
• Generation
  6 1
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Kryo 360 Gold 4x Cortex-A77
• B-Core
  6x Kryo 360 Silver 4x Cortex-A55
• Base Frequency
  1.7 GHz 2 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 2.2 GHz
• Turbo Frequency (8 Cores)
  1.7 GHz 2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.1 12
• Execution units
  0 7
• Generation
  6 Vallhall 1
• GPU Frequency
  700 MHz 700 MHz
• GPU name
  Qualcomm Adreno 615 ARM Mali-G77 MP7
• GPU Turbo
  700 MHz No turbo
• Max. displays
  0 1
• Max. GPU Memory
  - 4 GB
• Release date
  Q2/2018 Q2/2019
• Shader
  256 112
• Technology
  10 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Decode Decode / Encode
• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 1000L and Qualcomm Snapdragon 670. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 12 GB
• Memory channels
  2 4
• Memory type
  LPDDR4X-1866 LPDDR4X-1866

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 670 and MediaTek Dimensity 1000L Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 670 and MediaTek Dimensity 1000L, virtual machine technologies and process technology.

• Architecture
  Kryo 360 Cortex-A77 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  SDM670 MT6885Z/CZA
• Release date
  Q3/2018 Q1/2020
• Technology
  10 nm 7 nm
• Virtualization
  None None