MediaTek Dimensity 8200 vs Qualcomm Snapdragon 888 Plus. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Dimensity 8000 4nm Qualcomm Snapdragon 888
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  3 8
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Cortex-A78 1x Kryo 680 Prime
• A-Core Frequency
  3.1 GHz -
• B-Core
  3x Cortex-A78 3x Kryo 680 Gold
• B-Core Frequency
  3 GHz -
• C-Core
  4x Cortex-A55 4x Kryo 680 Silver
• C-Core Frequency
  2 GHz -
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Base Frequency
  - 1.8 GHz
• Turbo Frequency (1 Core)
  - 3 GHz
• Turbo Frequency (8 Cores)
  - 2.42 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.1
• Execution units
  6 0
• Generation
  Vallhall 3 6
• GPU Frequency
  - 840 MHz
• GPU name
  ARM Mali-G610 MP6 Qualcomm Adreno 660
• GPU Turbo
  No turbo No turbo
• Max. displays
  1 0
• Release date
  Q2/2021 Q1/2021
• Shader
  0 0
• Technology
  4 nm 5 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  Decode No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 888 Plus and MediaTek Dimensity 8200. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory Bandwidth
  51.2 GB/s -
• Memory channels
  4 (Quad Channel) 4
• Memory type
  LPDDR5-6400 LPDDR5-3200

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 8200 and Qualcomm Snapdragon 888 Plus Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 8200 and Qualcomm Snapdragon 888 Plus, virtual machine technologies and process technology.

• Architecture
  Cortex-A78 / -A78 / -A55 Kryo 680
• Chip design
  Chiplet -
• Documents
  Technical data sheet -
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  - 4 MB
• L3-Cache
  - 4 MB
• Operating systems
  Android -
• Part Number
  MT6896 / MT6896Z SM8350-AC
• Release date
  Q4/2022 Q3/2021
• Technology
  4 nm 5 nm
• Virtualization
  None None