MediaTek Dimensity 1000C vs Qualcomm Snapdragon 670. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  1 6
• CPU group
  MediaTek Dimensity 1000 Qualcomm Snapdragon 670

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  2.00 GHz 1.70 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.00 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A77 2x Kryo 360 Gold
• B core
  4x Cortex-A55 6x Kryo 360 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G57 MP5 Qualcomm Adreno 615
• GPU frequency
  0.95 GHz 0.70 GHz
• GPU (Turbo)
  No turbo 0.70 GHz
• Execution units
  5 0
• Shader
  80 256
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generation
  Vallhall 1 6
• DirectX Version
  12 12.1
• Technology
  7 nm 10 nm
• Release date
  Q2/2020 Q2/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 670 and MediaTek Dimensity 1000C. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memory
  12 GB
• ECC
  No No
• Memory channels
  4 2

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 1000C and Qualcomm Snapdragon 670 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 1000C and MediaTek Dimensity 1000C, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A77 / Cortex-A55 Kryo 360
• Technology
  7 nm 10 nm
• Socket
  N/A N/A
• Release date
  Q3/2020 Q3/2018
• Part Number
  MT6883Z/CZA SDM670