Qualcomm Snapdragon 7c Plus Gen 3 vs Intel Core i5-12600K. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Intel Core i5
• CPU group
  Qualcomm Snapdragon 7c Plus Intel Core i 12000
• Segment
  Mobile Desktop / Server
• Generation
  3 12
• Predecessor
  Qualcomm Snapdragon 7c Gen 2 Intel Core i5-11600K

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No Yes

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Unknown Intel Iris Xe Graphics 32 (Alder Lake S)
• GPU frequency
  0.70 GHz 0.40 GHz
• GPU (Turbo)
  No turbo 1.45 GHz
• Execution units
  0 32
• Shader
  0 256
• Max. GPU Memory
  -- 16 GB
• Max. displays
  0 4
• Generation
  12
• Technology
  10 nm
• Release date
  Q4/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode
• VP9
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Intel Core i5-12600K and Qualcomm Snapdragon 7c Plus Gen 3. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266LPDDR5-6400 DDR4-3200DDR5-4800
• Max. Memory
  256 GB
• Memory channels
  2 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 7c Plus Gen 3 and Intel Core i5-12600K to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  125 W
• TDP (PL2)
  -- 228 W / 56 s
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 and Qualcomm Snapdragon 7c Plus Gen 3, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX2+
• L3-Cache
  -- 20.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Alder Lake S
• Technology
  6 nm 10 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d
• Socket
  N/A LGA 1700
• Release date
  Q1/2022 Q4/2021
• Part Number
  -- BX8071512600K