HiSilicon Kirin 980 vs Qualcomm Snapdragon 8 Gen 1. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 980 Qualcomm Snapdragon 8 Gen 1
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  7 1
• Predecessor
  - Qualcomm Snapdragon 888
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 1x Cortex-X2
• B-Core
  2x Cortex-A76 3x Cortex-A710
• Base Frequency
  1.8 GHz 1.8 GHz
• C-Core
  4x Cortex-A55 4x Cortex-A510
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  1.9 GHz 3 GHz
• Turbo Frequency (8 Cores)
  2.6 GHz 2.5 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.1
• Execution units
  10 -
• Generation
  Bifrost 3 7
• GPU Frequency
  720 MHz 840 MHz
• GPU name
  ARM Mali-G76 MP10 Qualcomm Adreno 730
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 -
• Max. GPU Memory
  4 GB -
• Release date
  Q3/2018 Q1/2022
• Shader
  160 -
• Technology
  7 nm 4 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8 Gen 1 and HiSilicon Kirin 980. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB 16 GB
• Memory channels
  4 4
• Memory type
  LPDDR4X-2133 LPDDR5-3200

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 980 and Qualcomm Snapdragon 8 Gen 1 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  6 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 980 and Qualcomm Snapdragon 8 Gen 1, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Kryo
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  - 2 MB
• L3-Cache
  2 MB 4 MB
• Part Number
  - SM8450
• Release date
  Q4/2018 Q1/2022
• Technology
  7 nm 4 nm
• Virtualization
  None None