AMD Ryzen Embedded V3C14 vs AMD Ryzen Embedded V3C16. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  AMD Ryzen Embedded V3000 AMD Ryzen Embedded V3000
• Family
  AMD Ryzen Embedded V AMD Ryzen Embedded V
• Generation
  3 3
• Predecessor
  - AMD Ryzen Embedded V2516
• Segment
  Desktop / Server Desktop / Server

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• Base Frequency
  2.3 GHz 2 GHz
• Core architecture
  normal normal
• Core Configuration
  4x Zen 3 6x Zen 3
• CPU Cores
  4 6
• CPU Threads
  8 12
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No
• Turbo Frequency (1 Core)
  3.8 GHz 3.8 GHz
• Turbo Frequency (4 Cores)
  3.2 GHz -
• Turbo Frequency (6 Cores)
  - 3 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  no iGPU no iGPU
• GPU Turbo
  No turbo No turbo

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  No No
• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• JPEG
  No No
• VC-1
  No No
• VP8
  No No
• VP9
  No No

Types, channel quantity of RAM supported by AMD Ryzen Embedded V3C16 and AMD Ryzen Embedded V3C14. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  Yes Yes
• Max. Memory
  64 GB 64 GB
• Memory Bandwidth
  76.8 GB/s 76.8 GB/s
• Memory channels
  2 (Dual Channel) 2 (Dual Channel)
• Memory type
  DDR5-4800 DDR5-4800
• PCIe
  4.0 x 20 4.0 x 20

• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD Ryzen Embedded V3C14 and AMD Ryzen Embedded V3C16 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  105 °C 105 °C
• TDP (PL1, legacy label)
  15 W 15 W
• TDP down
  10 W 10 W
• TDP up
  25 W 25 W

Architecture, interfaces, additional instructions supported by AMD Ryzen Embedded V3C14 and AMD Ryzen Embedded V3C16, virtual machine technologies and process technology.

• Architecture
  Rembrandt (Zen 3+) Rembrandt (Zen 3+)
• Chip design
  Chiplet Chiplet
• Documents
  Technical data sheet Technical data sheet
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  2 MB 3 MB
• L3-Cache
  8 MB 16 MB
• Operating systems
  Windows 10, Windows 11, Linux Windows 10, Windows 11, Linux
• Release date
  Q3/2022 Q3/2022
• Socket
  FP7r2 FP7r2
• Technology
  6 nm 6 nm
• Virtualization
  AMD-V, SVM AMD-V, SVM