Qualcomm Snapdragon 845 vs MediaTek Helio G35. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 845 MediaTek Helio G25/G35
• Family
  Qualcomm Snapdragon Mediatek Helio
• Generation
  5 1
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Kryo 385 Gold 4x Cortex-A53
• B-Core
  4x Kryo 385 Silver 4x Cortex-A53
• Base Frequency
  1.8 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.8 GHz 2.3 GHz
• Turbo Frequency (8 Cores)
  2.8 GHz 1.8 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 10
• Execution units
  0 1
• Generation
  4 -
• GPU Frequency
  700 MHz 680 MHz
• GPU name
  Qualcomm Adreno 630 PowerVR GE8320
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 1
• Max. GPU Memory
  8 GB -
• Release date
  Q1/2018 Q1/2017
• Shader
  256 -
• Technology
  10 nm 20 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode | Decode / Encode No
• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  Decode No
• JPEG
  Decode / Encode No
• VC-1
  Decode No
• VP8
  Decode No
• VP9
  Decode No

Types, channel quantity of RAM supported by MediaTek Helio G35 and Qualcomm Snapdragon 845. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB 6 GB
• Memory channels
  4 1
• Memory type
  LPDDR4X-1866 LPDDR3-933LPDDR4-1600

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 845 and MediaTek Helio G35 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 845 and MediaTek Helio G35, virtual machine technologies and process technology.

• Architecture
  Kryo 385 Cortex-A53 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  0.51 MB -
• L3-Cache
  2 MB -
• Part Number
  SDM845 MT6765G
• Release date
  Q1/2018 Q2/2020
• Technology
  10 nm 12 nm
• Virtualization
  None None