Qualcomm Snapdragon 835 vs HiSilicon Kirin 960. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  4 5
• CPU group
  Qualcomm Snapdragon 830 HiSilicon Kirin 960

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.90 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.45 GHz 2.40 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.45 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 280 Gold 4x Cortex-A73
• B core
  4x Kryo 280 Silver 4x Cortex-A53

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 540 ARM Mali-G71 MP8
• GPU frequency
  0.71 GHz 0.90 GHz
• GPU (Turbo)
  0.71 GHz No turbo
• Execution units
  0 8
• Shader
  384 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 2
• Generation
  5 Bifrost 1
• DirectX Version
  11.1 11
• Technology
  10 nm 16 nm
• Release date
  Q1/2017 Q2/2016

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode Decode / Encode
• VP9
  Decode No
• VP8
  Decode Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  Decode No
• JPEG
  Decode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 960 and Qualcomm Snapdragon 835. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1866 LPDDR4-1600
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  2 2

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 835 and HiSilicon Kirin 960 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 835 and Qualcomm Snapdragon 835, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  -- 4.00 MB
• Architecture
  Kryo 280 Cortex-A73 / Cortex-A53
• Technology
  10 nm 16 nm
• Socket
  N/A N/A
• Release date
  Q2/2017 Q4/2016
• Part Number
  MSM8998 --