Intel Core i9-13900HK vs AMD Ryzen 5 PRO 4650U. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Intel Core i9 AMD Ryzen
• CPU group
  Intel Core i 13000H AMD Ryzen 4000U
• Segment
  Mobile Mobile
• Generation
  13 3
• Predecessor
  Intel Core i9-12900HK --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) normal
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Intel Iris Xe Graphics 96 (Alder Lake) AMD Radeon 6 Graphics (Renoir)
• GPU frequency
  0.40 GHz 1.50 GHz
• GPU (Turbo)
  1.50 GHz No turbo
• Execution units
  96 6
• Shader
  768 384
• Max. GPU Memory
  32 GB 2 GB
• Max. displays
  4 3
• Generation
  13 9
• Technology
  10 nm 7 nm
• Release date
  Q1/2022 Q1/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by AMD Ryzen 5 PRO 4650U and Intel Core i9-13900HK. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-3200DDR5-5200LPDDR4X-4266LPDDR5-6400 DDR4-3200LPDDR4-4266
• Max. Memory
  64 GB 64 GB
• Memory channels
  2 (Dual Channel) 2
• ECC
  No Yes

Compare the TDP requirements of TDP Intel Core i9-13900HK and AMD Ryzen 5 PRO 4650U to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL2)
  115 W --
• TDP up
  -- 25 W
• TDP down
  35 W 10 W
• Tjunction max.
  100 °C 105 °C

Architecture, interfaces, additional instructions supported by Intel Core i9-13900HK and Intel Core i9-13900HK, virtual machine technologies and process technology.

• Technology
  10 nm 7 nm
• Socket
  BGA 1744 FP6
• L3-Cache
  24.00 MB 8.00 MB
• Architecture
  Raptor Lake H Renoir (Zen 2)
• Virtualization
  VT-x, VT-x EPT, VT-d AMD-V, SVM
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX2+ SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Release date
  Q1/2023 Q2/2020