MediaTek Dimensity 900 vs Qualcomm Snapdragon 870. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  2 7
• CPU group
  MediaTek Dimensity 900/920 Qualcomm Snapdragon 865/870

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  2.00 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.40 GHz 3.20 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 2.42 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  2x Cortex-A78 1x Kryo 585 Prime
• B core
  6x Cortex-A55 3x Kryo 585 Gold
• C core
  -- 4x Kryo 585 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G68 MP4 Qualcomm Adreno 650
• GPU frequency
  0.85 GHz 0.25 GHz
• GPU (Turbo)
  No turbo 0.67 GHz
• Execution units
  4 2
• Shader
  64 512
• Max. displays
  1 1
• Generation
  Vallhall 2 6
• DirectX Version
  12 12.0
• Technology
  6 nm 7 nm
• Release date
  Q2/2020 Q4/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 870 and MediaTek Dimensity 900. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4XLPDDR5 LPDDR4X-4266LPDDR5-5500
• Max. Memory
  16 GB 16 GB
• ECC
  No No
• Memory channels
  4 4

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 900 and Qualcomm Snapdragon 870 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W 10 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 900 and MediaTek Dimensity 900, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  -- 2.00 MB
• L3-Cache
  2.00 MB 3.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo 585
• Technology
  6 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q2/2021 Q2/2021
• Part Number
  MT6877 SM8250-AC