HiSilicon Kirin 655 vs Qualcomm Snapdragon 625. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 650 Qualcomm Snapdragon 625/626
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  4 3
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A53 -
• B-Core
  4x Cortex-A53 -
• Base Frequency
  1.7 GHz 2 GHz
• Core architecture
  hybrid (big.LITTLE) normal
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.12 GHz 2 GHz
• Turbo Frequency (8 Cores)
  2.12 GHz 2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  2 0
• Generation
  Midgard 4 5
• GPU Frequency
  900 MHz 650 MHz
• GPU name
  ARM Mali-T830 MP2 Qualcomm Adreno 506
• GPU Turbo
  900 MHz 650 MHz
• Max. displays
  2 0
• Release date
  Q4/2015 Q4/2015
• Shader
  32 96
• Technology
  28nm 14 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No Decode
• VP8
  Decode / Encode No
• VP9
  No No

Types, channel quantity of RAM supported by Qualcomm Snapdragon 625 and HiSilicon Kirin 655. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory channels
  2 1
• Memory type
  LPDDR3-933 LPDDR3-933

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 655 and Qualcomm Snapdragon 625 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 655 and Qualcomm Snapdragon 625, virtual machine technologies and process technology.

• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  - MSM8953
• Release date
  Q2/2016 Q2/2016
• Technology
  16 nm 14 nm
• Virtualization
  None None