AMD Ryzen Embedded R2312 vs Intel Core i7-13700F. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  AMD Ryzen Embedded Intel Core i7
• CPU group
  AMD Ryzen Embedded R2000 Intel Core i 13000
• Segment
  Desktop / Server Desktop / Server
• Generation
  2 13
• Predecessor
  -- Intel Core i7-12700F

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  2 / 4 16 / 24
• Core architecture
  normal hybrid (big.LITTLE)
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  AMD Radeon Vega 3 Graphics no iGPU
• GPU frequency
  1.20 GHz --
• GPU (Turbo)
  No turbo No turbo
• Execution units
  3 --
• Shader
  192 --
• Max. GPU Memory
  2 GB --
• Max. displays
  3 --
• Generation
  8 --
• Direct X
  12 --
• Technology
  14 nm --
• Release date
  Q1/2018 --

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Types, channel quantity of RAM supported by Intel Core i7-13700F and AMD Ryzen Embedded R2312. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-2400 DDR5-5600
• Max. Memory
  32 GB 128 GB
• Memory channels
  2 2 (Dual Channel)
• Bandwidth
  38.4 GB/s 89.6 GB/s
• ECC
  Yes Yes
• PCIe
  3.0 x 8 5.0 x 20
• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD Ryzen Embedded R2312 and Intel Core i7-13700F to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 65 W
• TDP (PL2)
  -- 202 W
• TDP up
  25 W --
• TDP down
  12 W --
• Tjunction max.
  105 °C 100 °C

Architecture, interfaces, additional instructions supported by AMD Ryzen Embedded R2312 and AMD Ryzen Embedded R2312, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX2+
• L2-Cache
  1.00 MB 24.00 MB
• L3-Cache
  2.00 MB 30.00 MB
• Architecture
  Zen+ Raptor Lake S
• Technology
  12 nm 10 nm
• Virtualization
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Socket
  FP5 LGA 1700
• Release date
  Q2/2022 Q1/2023