Qualcomm Snapdragon 690 vs Intel Core i3-11100. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 690 Intel Core i 11000
• Family
  Qualcomm Snapdragon Intel Core i3
• Generation
  8 11
• Segment
  Mobile Desktop / Server

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Kryo 560 Gold -
• B-Core
  6x Kryo 560 Silver -
• Base Frequency
  1.7 GHz 3.8 GHz
• Core architecture
  hybrid (big.LITTLE) normal
• CPU Cores
  8 4
• CPU Threads
  8 8
• Hyperthreading / SMT
  No Yes
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 4.5 GHz
• Turbo Frequency (8 Cores)
  1.7 GHz -
• Turbo Frequency (4 Cores)
  - 4.3 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.1 12
• Execution units
  0 24
• Generation
  6 9.5
• GPU Frequency
  950 MHz 350 MHz
• GPU name
  Qualcomm Adreno 619L Intel UHD Graphics 630
• GPU Turbo
  No turbo 1100 MHz
• Max. displays
  0 3
• Max. GPU Memory
  - 64 GB
• Release date
  Q4/2020 Q4/2017
• Shader
  0 192
• Technology
  8 nm 14 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode Decode / Encode
• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode
• VC-1
  Decode Decode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i3-11100 and Qualcomm Snapdragon 690. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 128 GB
• Memory channels
  2 2
• Memory type
  LPDDR4X-1866 DDR4-2933
• PCIe lanes
  - 16
• PCIe version
  - 3.0

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 690 and Intel Core i3-11100 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  - 100 °C
• TDP (PL1, legacy label)
  - 65 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 690 and Intel Core i3-11100, virtual machine technologies and process technology.

• Architecture
  Kryo 560 Rocket Lake S
• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  - SSE4.1, SSE4.2, AVX2, AVX-512
• L3-Cache
  - 6 MB
• Part Number
  SM6350 -
• Release date
  Q4/2020 Q2/2021
• Socket
  - LGA 1200
• Technology
  8 nm 14 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d