Qualcomm Snapdragon 210 vs MediaTek Helio G25. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 205-212 MediaTek Helio G25/G35
• Family
  Qualcomm Snapdragon Mediatek Helio
• Generation
  2 1
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  - 4x Cortex-A53
• B-Core
  - 4x Cortex-A53
• Base Frequency
  1.1 GHz -
• Core architecture
  normal hybrid (big.LITTLE)
• CPU Cores
  4 8
• CPU Threads
  4 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  1.1 GHz -
• Turbo Frequency (4 Cores)
  1.1 GHz -
• A-Core Frequency
  - 2.00 GHz (2.00 GHz)
• B-Core Frequency
  - 1.50 GHz (1.50 GHz)

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 10
• Execution units
  0 1
• Generation
  3 -
• GPU Frequency
  400 MHz 650 MHz
• GPU name
  Qualcomm Adreno 304 PowerVR GE8320
• GPU Turbo
  400 MHz No turbo
• Max. displays
  0 1
• Release date
  Q3/2015 Q1/2017
• Shader
  24 -
• Technology
  28 nm 20 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No No
• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  No No
• JPEG
  Decode / Encode No
• VC-1
  Decode No
• VP8
  No No
• VP9
  No No

Types, channel quantity of RAM supported by MediaTek Helio G25 and Qualcomm Snapdragon 210. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 6 GB
• Memory channels
  1 1
• Memory type
  LPDDR2LPDDR3 LPDDR3-933LPDDR4X-1600

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 210 and MediaTek Helio G25 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 210 and MediaTek Helio G25, virtual machine technologies and process technology.

• Architecture
  Cortex-A7 Cortex-A53 / Cortex-A53
• Instruction set (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Part Number
  MSM8909 MT6762G
• Release date
  2014 Q2/2020
• Technology
  28 nm 12 nm
• Virtualization
  None None