HiSilicon Kirin 950 vs Qualcomm Snapdragon 690. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  4 8
• CPU group
  HiSilicon Kirin 950 Qualcomm Snapdragon 690

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.70 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.30 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.30 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A72 2x Kryo 560 Gold
• B core
  4x Cortex-A53 6x Kryo 560 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-T880 MP4 Qualcomm Adreno 619L
• GPU frequency
  0.90 GHz 0.95 GHz
• GPU (Turbo)
  0.90 GHz No turbo
• Execution units
  4 0
• Shader
  64 0
• Max. displays
  2 0
• Generation
  Midgard 4 6
• DirectX Version
  11 12.1
• Technology
  16 nm 8 nm
• Release date
  Q2/2016 Q4/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode
• VP9
  No Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 690 and HiSilicon Kirin 950. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4 LPDDR4X-1866
• ECC
  No No
• Memory channels
  2 2

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 950 and Qualcomm Snapdragon 690 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 950 and HiSilicon Kirin 950, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A72 / Cortex-A53 Kryo 560
• Technology
  16 nm 8 nm
• Socket
  N/A N/A
• Release date
  Q4/2015 Q4/2020
• Part Number
  -- SM6350