Qualcomm Snapdragon 7c Plus Gen 3 vs Intel Core i7-11700B. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 7c Plus Intel Core i 11000
• Family
  Qualcomm Snapdragon Intel Core i7
• Generation
  3 11
• Predecessor
  Qualcomm Snapdragon 7c Gen 2 -
• Segment
  Mobile Desktop / Server

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A78 -
• A-Core Frequency
  2.4 GHz -
• B-Core
  4x Cortex-A55 -
• B-Core Frequency
  1.5 GHz -
• Core architecture
  hybrid (big.LITTLE) normal
• CPU Cores
  8 8
• CPU Threads
  8 16
• Hyperthreading / SMT
  No Yes
• Overclocking
  No No
• Base Frequency
  - 3.2 GHz
• Turbo Frequency (1 Core)
  - 5.3 GHz
• Turbo Frequency (8 Cores)
  - 4 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  - 12
• Execution units
  0 32
• Generation
  - 12
• GPU Frequency
  700 MHz 350 MHz
• GPU name
  - Intel UHD Graphics 750
• GPU Turbo
  No turbo 1300 MHz
• Max. displays
  0 3
• Release date
  - Q1/2021
• Shader
  0 256
• Technology
  - 14 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  No Decode / Encode
• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• JPEG
  No Decode / Encode
• VC-1
  No Decode
• VP8
  No Decode
• VP9
  No Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-11700B and Qualcomm Snapdragon 7c Plus Gen 3. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 128 GB
• Memory Bandwidth
  25.6 GB/s -
• Memory channels
  2 2
• Memory type
  LPDDR4X-4266LPDDR5-6400 DDR4-3200
• PCIe lanes
  - 20
• PCIe version
  - 4.0

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 7c Plus Gen 3 and Intel Core i7-11700B Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  - 100 °C
• TDP (PL1, legacy label)
  - 65 W
• TDP (PL2)
  - 224 W / 56 s

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 and Intel Core i7-11700B, virtual machine technologies and process technology.

• Architecture
  Cortex-A78 / Cortex-A55 Rocket Lake S
• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  - SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  - 4 MB
• L3-Cache
  - 16 MB
• Operating systems
  Android -
• Release date
  Q1/2022 Q2/2021
• Socket
  - LGA 1200
• Technology
  6 nm 14 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d