MediaTek Dimensity 9200 vs Qualcomm Snapdragon 870. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Mediatek Dimensity Qualcomm Snapdragon
• CPU group
  MediaTek Dimensity 9200 Qualcomm Snapdragon 865/870
• Segment
  Mobile Mobile
• Generation
  4 7
• Predecessor
  MediaTek Dimensity 9000+ --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Immortalis-G715 MP11 Qualcomm Adreno 650
• GPU frequency
  0.90 GHz 0.25 GHz
• GPU (Turbo)
  No turbo 0.67 GHz
• Execution units
  11 2
• Shader
  -- 512
• Max. displays
  -- 1
• Generation
  Vallhall 6
• Technology
  4 nm 7 nm
• Release date
  Q4/2022 Q4/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 870 and MediaTek Dimensity 9200. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5X-8533 LPDDR4X-4266LPDDR5-5500
• Max. Memory
  -- 16 GB
• Memory channels
  4 (Quad Channel) 4
• ECC
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 9200 and Qualcomm Snapdragon 870 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  -- 10 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 9200 and MediaTek Dimensity 9200, virtual machine technologies and process technology.

• Technology
  4 nm 7 nm
• Socket
  N/A N/A
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• Architecture
  Cortex-X3 / -A715 / -A510 Kryo 585
• Virtualization
  None None
• Instruction set (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  --
• Release date
  Q4/2022 Q2/2021
• Part Number
  -- SM8250-AC