MediaTek Dimensity 9200 vs HiSilicon Kirin 990 5G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Mediatek Dimensity HiSilicon Kirin
• CPU group
  MediaTek Dimensity 9200 HiSilicon Kirin 990
• Segment
  Mobile Mobile
• Generation
  4 8
• Predecessor
  MediaTek Dimensity 9000+ --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Immortalis-G715 MP11 ARM Mali-G76 MP16
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  11 16
• Shader
  -- 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  -- 2
• Generation
  Vallhall Bifrost 3
• Technology
  4 nm 7 nm
• Release date
  Q4/2022 Q3/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 990 5G and MediaTek Dimensity 9200. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5X-8533 LPDDR4X-4266
• Max. Memory
  -- 8 GB
• Memory channels
  4 (Quad Channel) 4
• ECC
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 9200 and HiSilicon Kirin 990 5G to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  -- 6 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 9200 and MediaTek Dimensity 9200, virtual machine technologies and process technology.

• Technology
  4 nm 7 nm
• Socket
  N/A N/A
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-X3 / -A715 / -A510 Cortex-A76 / Cortex-A55
• Virtualization
  None None
• Instruction set (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  --
• Release date
  Q4/2022 Q3/2019