Intel Xeon w7-2475X vs AMD Ryzen Embedded V3C18I. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Intel Xeon W-2400 AMD Ryzen Embedded V3000
• Family
  Intel Xeon W AMD Ryzen Embedded V
• Generation
  12 3
• Predecessor
  Intel Xeon W-2275 AMD Ryzen Embedded V2718
• Segment
  Desktop / Server Desktop / Server

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• Base Frequency
  2.6 GHz 1.9 GHz
• Core architecture
  normal normal
• Core Configuration
  20x 8x Zen 3
• CPU Cores
  20 8
• CPU Threads
  40 16
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  Yes No
• Turbo Frequency (1 Core)
  4.8 GHz 3.8 GHz
• Turbo Frequency (20 Cores)
  3.4 GHz -
• Turbo Frequency (8 Cores)
  - 2.7 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  no iGPU no iGPU
• GPU Turbo
  No turbo No turbo

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  No No
• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• JPEG
  No No
• VC-1
  No No
• VP8
  No No
• VP9
  No No

Types, channel quantity of RAM supported by AMD Ryzen Embedded V3C18I and Intel Xeon w7-2475X. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  Yes Yes
• Max. Memory
  2048 GB 64 GB
• Memory Bandwidth
  153.6 GB/s 76.8 GB/s
• Memory channels
  4 (Quad Channel) 2 (Dual Channel)
• Memory type
  DDR5-4800 DDR5-4800
• PCIe
  5.0 x 64 4.0 x 20

• AES-NI
  Yes Yes

Compare the TDP requirements of TDP Intel Xeon w7-2475X and AMD Ryzen Embedded V3C18I Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  94 °C 105 °C
• TDP (PL1 / PBP, legacy combined label)
  225 W -
• TDP down
  - 10 W
• TDP up
  270 W 25 W
• TDP (PL1, legacy label)
  - 15 W

Architecture, interfaces, additional instructions supported by Intel Xeon w7-2475X and AMD Ryzen Embedded V3C18I, virtual machine technologies and process technology.

• Architecture
  Sapphire Rapids-WS Rembrandt (Zen 3+)
• Chip design
  Monolithic Chiplet
• Documents
  Technical data sheet Technical data sheet
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX-512, AMX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  - 4 MB
• L3-Cache
  37.5 MB 16 MB
• Operating systems
  Windows 11, Windows Server, Linux Windows 10, Windows 11, Linux
• Release date
  Q1/2023 Q3/2022
• Release price
  1789 $ -
• Socket
  LGA 4677 FP7r2
• Technology
  10 nm 6 nm
• Virtualization
  VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise AMD-V, SVM