HiSilicon Kirin 990 4G vs MediaTek Dimensity 1200. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 990 MediaTek Dimensity 1100/1200
• Family
  HiSilicon Kirin Mediatek Dimensity
• Generation
  8 2
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 1x Cortex-A78
• B-Core
  2x Cortex-A76 3x Cortex-A78
• Base Frequency
  1.86 GHz 2 GHz
• C-Core
  4x Cortex-A55 4x Cortex-A55
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.09 GHz 3 GHz
• Turbo Frequency (8 Cores)
  2.86 GHz 2.6 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  16 9
• Generation
  Bifrost 3 Vallhall 1
• GPU Frequency
  600 MHz 850 MHz
• GPU name
  ARM Mali-G76 MP16 ARM Mali-G77 MP9
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 1
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q3/2018 Q2/2019
• Shader
  256 144
• Technology
  7 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 1200 and HiSilicon Kirin 990 4G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB -
• Memory channels
  4 4
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 990 4G and MediaTek Dimensity 1200 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  6 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 990 4G and MediaTek Dimensity 1200, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A78 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB -
• Part Number
  - MT6893
• Release date
  Q3/2019 Q1/2021
• Technology
  7 nm 6 nm
• Virtualization
  None None