HiSilicon Kirin 960 vs HiSilicon Kirin 650. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  5 4
• CPU group
  HiSilicon Kirin 960 HiSilicon Kirin 650

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.70 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.40 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.40 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A73 4x Cortex-A53
• B core
  4x Cortex-A53 4x Cortex-A53

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G71 MP8 ARM Mali-T830 MP2
• GPU frequency
  0.90 GHz 0.90 GHz
• GPU (Turbo)
  No turbo 0.90 GHz
• Execution units
  8 2
• Shader
  256 32
• Max. GPU Memory
  2 GB --
• Max. displays
  2 2
• Generation
  Bifrost 1 Midgard 4
• DirectX Version
  11 11
• Technology
  16 nm 28nm
• Release date
  Q2/2016 Q4/2015

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  No No
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 650 and HiSilicon Kirin 960. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4-1600 LPDDR3-933
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  2 2

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 960 and HiSilicon Kirin 650 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 960 and HiSilicon Kirin 960, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  4.00 MB --
• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A53 / Cortex-A53
• Technology
  16 nm 16 nm
• Socket
  N/A N/A
• Release date
  Q4/2016 Q2/2016