HiSilicon Kirin 9000E vs HiSilicon Kirin 990 4G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 9000 HiSilicon Kirin 990
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  9 8
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Cortex-A77 2x Cortex-A76
• B-Core
  3x Cortex-A77 2x Cortex-A76
• Base Frequency
  2.04 GHz 1.86 GHz
• C-Core
  4x Cortex-A55 4x Cortex-A55
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  3.13 GHz 2.09 GHz
• Turbo Frequency (8 Cores)
  2.54 GHz 2.86 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  22 16
• Generation
  Vallhall 2 Bifrost 3
• GPU Frequency
  760 MHz 600 MHz
• GPU name
  ARM Mali-G78 MP22 ARM Mali-G76 MP16
• GPU Turbo
  No turbo No turbo
• Max. displays
  1 2
• Max. GPU Memory
  - 4 GB
• Release date
  Q4/2020 Q3/2018
• Shader
  352 256
• Technology
  5 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  Decode No
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 990 4G and HiSilicon Kirin 9000E. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 8 GB
• Memory channels
  4 4
• Memory type
  LPDDR4X-2133LPDDR5-2750 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 9000E and HiSilicon Kirin 990 4G Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 6 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 9000E and HiSilicon Kirin 990 4G, virtual machine technologies and process technology.

• Architecture
  Cortex-A77 / Cortex-A55 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  - 2 MB
• Release date
  Q4/2020 Q3/2019
• Technology
  5 nm 7 nm
• Virtualization
  None None